History

The Inclusive Engineering Consortium is a culmination of nearly two decades of collaboration between historically minority serving institutions.

Timeline

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The Mobile Studio Project (RPI), with funding from NSF, Hewlett-Packard, and Analog Devices, demonstrated improved learning through hands-on activities enabled by personal instrumentation. Howard and Rose-Hulman were early partners.

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The LESA ERC brought RPI, Howard, and Morgan State together on research and education

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LESA and Intel provided funding to bring together all 13 HBCUs with ECE programs for a meeting of which 11 additional HBCUs were introduced to Mobile Studio Pedagogy

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NSF was consulted on how best to expand this development of new pedagogy to HBCU ECE programs and they encouraged all 13 schools to submit a joint proposal. 

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Mobile Hands-On STEM merged Mobile Studio with TESSAL (Georgia Tech) and Lab-In-A-Box (Virginia Tech) to advance the use of personal instrumentation

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The NSF HBCU ECP program, with its 13 collaborators, was the first program of this scale, resulting in fundamental changes in how ECE education is offered. This group is a model for how minority serving schools can work together productively.

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The success of the HBCU-ECP Program led to the formalization of the Inclusive Engineering Consortium (IEC)

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Inclusive Engineering Consortium
Two Prudential Plaza
180 North Stetson Avenue, Suite 3500
Chicago, Illinois 60601

Phone: 773-456-9002
info@iec.org

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