Press Releases
Leading Companies to Exhibit Products at Broadband World Forum Asia Technology Exhibition in Yokohama, Japan
Contact: Cliff Ward
Phone: +1 312-559-3325
E-Mail: cward@iec.org
YOKOHAMA, Japan – April 14, 2005 – Some of the most famous names in broadband communications will display their latest products at the upcoming Broadband World Forum Asia conference and technology exhibition.
The Broadband World Forum Asia technology exhibition will take place 31 May – 1 June 2005 at the Pacifico Yokohama Convention Center, near Tokyo. It is part of the four-day schedule of Forum activities that will take place 30 May - 2 June at the center.
The technology exhibition will feature leading vendors and manufacturers of products, services, solutions, and applications in the fast-growing field of high-speed communications. The exhibition will provide attendees an opportunity to see the latest advances gathered at one venue.
"Forum delegates will have a unique opportunity to learn about and discuss the latest broadband methods during the educational conference, and then see the products and solutions driving those new methods during the technology exhibition," said John Janowiak, president of the International Engineering Consortium, which is presenting the conference in conjunction with the official sponsor, NTT.
In addition to NTT, other leading exhibitors include Alcatel, Fujitsu, Alaxala Networks, Infineon, NEC, and Kyocera.
The Broadband World Forum Asia will also include keynote speeches from industry leaders, networking opportunities for key executives, and more than 30 educational sessions, plenary panels, and workshops. To register for the conference or for more information, visit http://www.iec.org/events/2005/bbwf_asia/.
The IEC (www.iec.org) is a non-profit, university-affiliated organization dedicated to catalyzing positive change in the information industry. The IEC, which is headquartered in Chicago, Illinois, USA, publishes research, develops educational forums, and provides Web-based learning programs.
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