The IEC's DesignCon 2007 Conference and Exhibition Hosts Thousands of Design Engineers, Award-Winning Products and Industry Leaders in Santa Clara
CHICAGO – February 7, 2007 – The International Engineering Consortium's (IEC's) DesignCon 2007 hosted key industry leaders, top vendors, thousands of electronic design professionals and members of academia at the Santa Clara Convention Center last week with sponsors such as Agilent Technologies (official sponsor), Rambus, LeCroy Corporation, Tektronix, BERTScope, Reed Electronics Group and more.
IEC President John Janowiak celebrated the success of the show, saying, "We are very pleased that many of our constituents commended the success of DesignCon 2007. It was well attended, and the conference continues to be extremely popular, as can be measured by the commitment and attendance year after year of the industry's leading professionals and companies."
Featuring discussions on silicon intellectual property, the future of engineering education, model-based DFM, emerging challenges, 65-nm technology, triple play and globalization; the DesignVision Awards; and more, DesignCon 2007 drew more than 5,000 people to register and housed more than 300 industry experts who spoke in more than 100 educational tutorials, plenary panels and paper presentations.
Industry leaders shared their knowledge and experience in keynote addresses and various panels and presented their award-winning papers in comprehensive seminars. Keynoters Steve Polzin (AMD), Willem Roelandts (Xilinx) and Leah Jamieson (Purdue University and IEEE) joined other key industry players such as Brendan Farley (Silicon and Software Systems), Kathy Werner (Freescale Semiconductor), Steve Carlson (Cadence), Kazu Yamada (NEC Electronics America), Michael Keating (Synopsys) and Jim Hogan (Vista Ventures).
In addition, a record-breaking number of 130 DesignCon vendors and associations exhibited, which provided a host of knowledgeable experts and leading-edge design tools. The exhibition floor featured product announcements; Hot Technologies; and pavilions that focused on PCB technology, design verification and semiconductor and IP technology.
The DesignVision Awards also took place at DesignCon last week, recognizing technologies, tools and products judged to be the most beneficial to the electronic design industry. Winning companies included Cadence Design Systems, OneSpin Solutions, Denali Software, PCB Libraries, National Semiconductor, Stratosphere Solutions, Altium Limited, Xilinx, Synplicity, Inc., Chip Estimate, Agilent Technologies, LeCroy and Tektronix, Inc.
The 2006 DesignCon Paper Award winners were also acknowledged last week in Santa Clara for their outstanding contributions to the educational goals of the DesignCon program.
The Business Forum, sponsored by Reed Electronics Group, featured two days of panel sessions led by senior managers and executives addressing critical business and strategy issues of concern to those responsible for directing the design process.
Co-located events such as the Ethernet Alliance Open Meeting and the IBIS Summit also took place, bringing their members from around the nation to the show.
Finally, TecPreviews took the stage, providing 20-minute product presentations with multimedia support that complement associated conference papers.
For complete show coverage, photos and highlights, visit www.designcon.com/2007 or contact Lisa Ann Reyes at +1-312-559-3325 or firstname.lastname@example.org.
DesignCon serves as the premier event for practicing engineers in the electrical design and semiconductor communities. Broadening the scope to address business as well as technical issues of the industry, DesignCon 2006 hosted 125 exhibiting companies and drew more than 5,000 industry professionals to register. This year's DesignCon will host more than 300 industry experts to speak in more than 100 educational tutorials, plenary panels, paper presentations, and sessions at DesignCon. Complementing the conference, more than 125 exhibitors are expected to take the floor exhibiting the latest technological developments. Visit www.designcon.com/2007.
About the IEC
A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students.
In conjunction with industry-leading companies, the IEC has developed an extensive, free, on-line educational program. The IEC conducts industry-university programs that have a substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age.
More than 70 leading high-technology universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. The IEC also manages the activities of the Enterprise Communications Consortium. Visit www.iec.org.